Innodisk has recently announced the availability of a 16 GB DDR4 module designed for use in servers and embedded systems. The new specification adds capacity to those devices, which have a need for high speed memory access in a limited space. The new DDR4 modules run at 2133 MHz and come in a variety of formats, including Long DIMM, SODIMM, and unbuffered DIMM (UDIMM) with ECC.
The DDR4 specification amends on the speed of DDR3 modules, which had speeds that topped out at 1833 MHz. Though DDR4 offers higher speeds, the capacity of modules for DDR4 haven’t yet reached those of the previous generation. With space for expansion often at a premium in these systems, many that include only a single slot for RAM, making the capacity available in a single module is very important. Embedded systems are those components that are a dedicated part of a larger system. They are typically used in industrial applications, such as monitoring and automating manufacturing systems. Increasingly they are the components that are making the Internet of Things possible.
DDR3 modules are readily available with a 32 GB capacity, so increasing the capacity from 8 GB to 16 GB starts to make the higher speeds available in the DDR4 modules more attractive for embedded systems and high density servers. Samson Chang, VP of Embedded DRAM Business Unit, Innodisk said, “16 GB is the highest capacity unbuffered DDR4 module available in the market.
We should be proud that Innodisk is able to provide this memory capacity while bringing the performance and low power benefits of DDR4 to the embedded and server markets. Additionally, we are bringing extra value to our industrial customers with Innodisk features like on-board thermal sensors and protective coatings.”
Innodisk supplies additional options and services for many of its memory modules, and you can apply conformable coating to the chips for both the SODIMM and the UDIMM format of the 16 GB DDR4 modules. The conformable coating protects against moisture, dust and contaminants, and electrical and thermal conduction.